Black Opal HX100 DDR5 Heatsink Memory

  • Data rates up to 7200 MT/s
  • Operating temperature decreased by over 5 °C
  • One-click overclocking

Biwin HX100 High-Performance Overclocking DDR5 Memory Module

With a unique heat-spreader design, Biwin HX100 can decrease the operating temperature by over 5 °Celsius. Equipped with premium ICs and an unlocked PMIC for higher voltage, HX100 is capable of one-click overclocking with data rates of up to 7200 MT/s, supporting XMP 3.0 and AMD EXPO.

2024 Red Dot Winner, Exceptional Design Aesthetics

Biwin HX100 won the “Oscars” of the design world– the German Red Dot Award for exceptional design aesthetic. It possesses seven cooling fins for heat dissipation as well as a tough texture.

Premium Heat Dissipation, Stable Overclocking

The special design of Biwin HX100 for optimized heat dissipation features a high-efficient thermal conductive silicone pad and the highest-grade aluminum heat spreader with parallel cooling fins, forming an armor that combines aesthetics with cooling efficiency. The high-efficient thermal conductive silicone pad is closely attached to the memory ICs, rapidly transferring heat to the heat spreader. All of these features help HX100 decrease the operating temperature by over 5 °Celsius.

DDR5 Overclocking, Superior Gaming Performance

With gaming-grade performance, high data rates, and low latency, Biwin HX100 is designed for overclockers and gaming enthusiasts, and is capable of intense competitions.

Premium ICs, Enhanced Overclocking Potential

Biwin HX100 is built with premium ICs selected automatically, setting a strong foundation for high performance and great overclocking potential.

PMIC, Unlocked Voltage

Equipped with an unlocked PMIC for better overclocking, Biwin HX100 offers a continuous and stable power delivery, satisfying your exploration of memory overclocking.

One-Click Overclocking, Supporting XMP 3.0 and AMD EXPO

Biwin HX100 supports overclocking with XMP 3.0 and AMD EXPO to unlock high-speed with one click, and to help you outpace your gaming competitors right from the start.

Wide Compatibility with Mainstream DDR5 Motherboards

HX100 is compatible with major DDR5 motherboards, offering a stable and reliable user experience.

Superior Performance Across All Scenarios

Biwin HX100 features superior performance across all intensive user scenarios – a winning product for a better gaming experience, impressive overclocking, faster video editing, and smoother 3D modeling.

Solid Technology for Reliable Quality

With a base of solid technology, Biwin HX100 provides consumers with a durable, reliable, and trustworthy choice for intensive endeavors. Built with selected premium materials, precise chip packaging expertise, and a battery of rigorous lab tests for production, the HX100 can satisfy even the needs of the most serious gamers, overclockers,3D modelers, and content creators.

Series
Black Opal:Gaming
Category
Memory
Model Name
Biwin Black Opal HX100
RAM Type
DDR5 Heatsink UDIMM
Color
Black, Silver
Capacity
32 GB (16 GB x 2)
48 GB (24 GB x 2)
64 GB (32 GB x 2)
Data Rate
6000 MT/s, 6400 MT/s, 6600 MT/s, 6800 MT/s, 7200 MT/s
Timing
CL28
CL30
CL32
CL34
CL36
Rank
1R x 8 / 2R x 8
Operating Voltage
1.35 V / 1.40 V
Pin
288 Pin
Dimensions
136.60 x 47.00 x 8.40 mm
Operating Temperature
0℃ to +85℃
Storage Temperature
-40°C to +85°C
Certifications
CE, FCC, RoHS, VCCI, RCM, BSMI, UKCA
Warranty
Limited Lifetime
*7200 MT/s: The data is based on test results from BIWIN’s internal labs and is for reference only. It may vary depending on the device and environment.
*Read Speeds: The data is based on test results at a data rate of 7200 MT/s from BIWIN's internal labs, specifically for the capacity of 32 GB: 16 GB x 2, and is for reference only. It may vary depending on the device. Exercise caution when manually overclocking, and please conduct overclocking tests according to platform standard specifications.
*Temperature decreased by over 5℃:The data is based on test results from BWIN's internal labs conducted according to platform standard specifications and is for reference only. Actual use may vary depending on the device and environment.
*58.8% Increase in Cooling Area: The data is based on comparative tests of similar products in BIWIN's internal labs, showing a significant improvement in cooling performance. Compared to a flat design, the grooved design increases the cooling area by 58.8%.
*Please back up important data when using the product. The free change of a new product is available for any quality issues, excluding the service for data recovery and data loss.
*Limited Lifetime Warranty covers the entire product life cycle including official production, market supply, maintenance, repair, and other services, up to the end of the product life.
*Product images shown above are for reference only. For specifics, please refer to the actual product.
*Product packaging, appearance, and additional software may vary due to shipping dates and available inventory.
*Maintenance and future updates are required throughout the product life cycle. Specifications are subject to change without notice.
File Name
Date
Operate
Black Opal HX100 Specifications
2025-06-23
Memory Module Platform Compatibility List
2025-06-17
Biwin Memory Quick Start Guide
2025-06-23