The Biwin Black Opal X570 PCIe Gen5x4 NVMe 2.0 SSD delivers impressive sequential read/write speeds up to 14500 MB/s and 11000 MB/s. Built with premium 3D TLC NAND, it handles demanding tasks with ease, whether for gaming, video editing, or AI model training. With advanced thermal management, the X570 ensures a stable performance even under heavy workloads. With up to 2400 TBW and a 5-year limited warranty, the Biwin X570 offers optimized endurance with proven reliability.
Taking full advantage of PCIe Gen5x4 and NVMe 2.0, the Biwin X570 achieves ultra-fast read speeds up to 14500 MB/s—approaching the maximum limit of PCIe 5.0. Equipped with premium 3D TLC NAND, it ensures peak performance even under intense workloads. From loading massive AAA games, transferring 4K/8K footage, or accelerating AI model training, the Biwin X570 turns heavy workloads into smooth operations.
*It is recommended for use with AMD Ryzen 9000 series processors and X870 motherboards. Install on the PCIe 5.0 M.2 interface for optimal performance.
*Tested by BIWIN’s labs. Actual performance may vary due to devices and environment.
*Compared to PCIe 4.0 SSDs with 7000 MB/s read speed and PCIe 3.0 SSDs with 3500 MB/s read speed.
The Biwin X570 uses Host Memory Buffer (HMB) and intelligent SLC cache to speed up response times. HMB allows the SSD to use the host´s DRAM to improve I/O performance, while dynamic SLC cache intelligently reallocates cache blocks, optimizing SSD efficiency and extending its lifespan. This caching architecture enables faster, more stable, and improved responsive operations within an optimized DRAM-less design.
Efficient thermal management ensures consistent performance under sustained workloads. Biwin X570 integrates a temperature control algorithm and thermal graphene pad to improve heat dissipation efficiency. Supported by Thermal Throttling and Power Management, the drive maintains optimal operating conditions during prolonged high-speed data transfer, multi-tasking, and gaming scenarios, ensuring reliable performance during even the most intensive usage cycles.
The Biwin X570 features a single-sided, DRAM-less design supported by advanced packaging technology that enables a slimmer profile, lower power consumption and more efficient heat dissipation. Compatible with PCIe 4.0 and PCIe 3.0*, the drive fits seamlessly into a wide range of devices and platforms. It’s ideal for flexible upgrades in today´s systems.
Available in 1 TB, 2 TB and 4 TB capacities, the Biwin X570 provides ample space for today’s high-volume requirements. To support ongoing storage needs, it features a full-capacity design that maximizes actual usable space within each configuration. From large AAA titles to high-resolution media files and professional workloads, you can store everything on a single drive without the need for additional devices or constant data management.
Creative, competitive, and compute-intensive, the Biwin X570 handles demanding workloads with consistent performance and stability. Whether running competitive games, editing high-resolution video, modeling in 3D, or accelerating AI-driven workflows, it delivers the sustained speed and responsiveness needed for smooth operation. With broad support for diverse tasks, the Biwin X570 maintains stable performance even under pressure.
Built with premium TLC NAND, Biwin X570 is designed for long-term reliability under heavy workloads. With a TBW rating of up to 2400, it ensures stable write performance over extended periods of use. Backed by a 5-year limited warranty, the Biwin X570 provides the consistency and security required in both personal and professional environments.
Biwin Intelligence is multifunctional management software for SSDs and portable SSDs, designed to support Biwin consumer-brand storage products. For a more convenient and more secure storage experience, this software helps users manage their drives with features like performance test, data migration, firmware update, and more.
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